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september 2013 doc id 10826 rev 6 1/25 1 VND830PEP-E double channel high side driver features cmos compatible inputs open drain status outputs on-state open load detection off-state open load detection shorted load protection undervoltage and overvoltage shutdown protection against loss of ground very low standby current reverse battery protection (see application schematic on page 16 ) in compliance with the 2002/95/ec european directive description the VND830PEP-E is a monolithic device designed in stmicroelectronics vipower? m0-3 technology, intended for driving any kind of load with one side connected to ground. active v cc pin voltage clamp protects the device against low energy spikes (see iso7637 transient compatibility table). active current limitation combined with thermal shutdown and automatic restart protects the device against overload. the device detects open load condition both in on and off-state. output shorted to v cc is detected in the off-state. device automatically turns off in case of ground pin disconnection. type r ds(on) i out v cc VND830PEP-E 60m (1) 1. per each channel. 6a (1) 36v powersso-24 table 1. device summary package order codes tube tape and reel powersso-24 VND830PEP-E vnd830peptr-e www.st.com obsolete product(s) - obsolete product(s)
contents VND830PEP-E 2/25 doc id 10826 rev 6 contents 1 block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.4 electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3 application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.1 gnd protection network against reverse battery . . . . . . . . . . . . . . . . . . . 16 3.1.1 solution 1: a resistor in the ground line (rgnd only) . . . . . . . . . . . . . . 16 3.1.2 solution 2: a diode (d gnd ) in the ground line . . . . . . . . . . . . . . . . . . . . 17 3.2 load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.3 mcu i/o protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.4 open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4 package and pc board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.1 powersso-24 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.1 ecopack? packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.2 powersso-24 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 obsolete product(s) - obsolete product(s)
VND830PEP-E list of tables doc id 10826 rev 6 3/25 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 table 3. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 4. thermal data (per island) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 5. power output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 6. switching (v cc = 13v) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 7. v cc - output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 8. status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 9. logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 10. protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 11. open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 12. truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 13. electrical transient requirements on v cc pin (part 1/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 14. electrical transient requirements on v cc pin (part 2/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 15. electrical transient requirements on v cc pin (part 3/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 16. thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 table 17. powersso-24 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 18. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 obsolete product(s) - obsolete product(s)
list of figures VND830PEP-E 4/25 doc id 10826 rev 6 list of figures figure 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 3. current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 4. open-load status timing (with external pull-up) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 5. over temperature status timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 6. switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 7. waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 8. off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 9. high level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 10. input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 11. status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 12. status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 13. status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 14. turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 15. turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 16. on-state resistance vs tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 17. on-state resistance vs vcc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 18. ilim vs tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 19. input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 20. open-load on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 21. open-load off-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 22. input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 23. input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 24. overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 25. undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 26. application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 27. open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 28. powersso-24 pc board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 29. rthj-amb vs pcb copper area in open box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 30. powersso-24 thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . 20 figure 31. thermal fitting model of a double channel hsd in powersso-24 . . . . . . . . . . . . . . . . . . . 20 figure 32. powersso-24 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 obsolete product(s) - obsolete product(s)
VND830PEP-E block diagram and pin description doc id 10826 rev 6 5/25 1 block diagram and pin description figure 1. block diagram figure 2. configuration diagram (top view) table 2. suggested connections for unused and not connected pins connection / pin current sense n.c. output input floating x x x to ground through 1k resistor x through 10k resistor output2 output2 output2 output2 nc input1 gnd v cc nc input2 output2 output2 output1 output1 output1 output1 nc v cc c.sense1 nc nc c.sense2 output1 output1 tab = v cc obsolete product(s) - obsolete product(s)
electrical specifications VND830PEP-E 6/25 doc id 10826 rev 6 2 electrical specifications 2.1 absolute maximum ratings stressing the device above the rating listed in the ?absolute maximum ratings? table may cause permanent damage to the device. these are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. refer also to the stmicroelectronics sure program and other relevant quality document. 2.2 thermal data table 3. absolute maximum ratings symbol parameter value unit v cc dc supply voltage 41 v - v cc reverse dc supply voltage - 0.3 v - i gnd dc reverse ground pin current - 200 ma i out dc output current internally limited a -i out reverse dc output current - 6 a i in dc input current +/- 10 ma i stat dc status current +/- 10 ma v esd electrostatic discharge (human body model:r=1.5k ; c=100pf) ? input ?status ?output ?v cc 4000 4000 5000 5000 v v v v p tot power dissipation t c = 25c 54 w t j junction operating temperature internally limited c t c case operating temperature - 40 to 150 c t stg storage temperature - 55 to 150 c table 4. thermal data (per island) symbol parameter value unit r thj-case thermal resistance junction-case (max) 2.3 c/w r thj-amb thermal resistance junction-ambient (one chip on) (max) 57 (1) 1. when mounted on a standard single-sided fr-4 board with 0.5cm 2 of cu (at least 35m thick) connected to all v cc pins. 42 (2) 2. when mounted on a standard single-sided fr-4 board with 8cm 2 of cu (at least 35m thick) connected to all v cc pins. c/w obsolete product(s) - obsolete product(s)
VND830PEP-E electrical specifications doc id 10826 rev 6 7/25 2.3 electrical characteristics values specified in this section are for 8v < v cc < 36v; -40c < t j < 150c, unless otherwise stated. figure 3. current and voltage conventions note: v fn = v ccn - v outn during reverse battery condition. table 5. power output symbol parameter test conditions min. typ. max. unit v cc operating supply voltage 5.5 13 36 v v usd undervoltage shutdown 3 4 5.5 v v ov overvoltage shutdown 36 v r on on-state resistance i out = 2a; t j = 25c i out = 2a; t j = 125c 60 120 m m i s supply current off-state; v cc = 13v; v in = v out = 0v off-state; v cc = 13v; v in = v out = 0v; t j = 25c on-state; v cc = 13v; v in = 5v; i out = 0a 12 12 5 40 25 7 a a ma i l(off1) off-state output current v in = v out = 0v 0 50 a i l(off2) off-state output current v in = 0v; v out = 3.5v -75 0 a i l(off3) off-state output current v in = v out = 0v; v cc = 13v; t j = 125c 5a i l(off4) off-state output current v in = v out = 0v; v cc = 13v; t j = 25c 3a obsolete product(s) - obsolete product(s)
electrical specifications VND830PEP-E 8/25 doc id 10826 rev 6 table 6. switching (v cc = 13v) symbol parameter test conditions min. typ. max. unit t d(on) turn-on delay time r l = 6.5 from v in rising edge to v out = 1.3v -30 -s t d(off) turn-off delay time r l = 6.5 from v in falling edge to v out = 11.7v -30 -s dv out /dt (on) turn-on voltage slope r l = 6.5 from v out = 1.3v to v out = 10.4v - see figure 14 -v/s dv out /dt (off) turn-off voltage slope r l = 6.5 from v out = 11.7v to v out = 1.3v - see figure 13 -v/s table 7. v cc - output diode symbol parameter test conditions min. typ. max. unit v f forward on voltage - i out = 1.3a; t j = 150c - - 0.6 v table 8. status pin symbol parameter test conditions min. typ. max. unit v stat status low output volt- age i stat = 1.6 ma 0.5 v i lstat status leakage current normal operation; v stat = 5v 10 a c stat status pin input capacitance normal operation; v stat = 5v 100 pf v scl status clamp voltage i stat = 1ma i stat = - 1ma 66.8 -0.7 8v v table 9. logic inputs symbol parameter test conditions min. typ. max. unit v il input low level 1.25 v i il low level input current v in = 1.25v 1 a v ih input high level 3.25 v i ih high level input current v in = 3.25v 10 a v i(hyst) input hysteresis voltage 0.5 v v icl input clamp voltage i in = 1ma i in = -1ma 66.8 - 0.7 8v v table 10. protections (1) symbol parameter test conditions min. typ. max. unit t tsd shutdown temperature 150 175 200 c t r reset temperature 135 c obsolete product(s) - obsolete product(s)
VND830PEP-E electrical specifications doc id 10826 rev 6 9/25 figure 4. open-load status timing (with external pull-up) t hyst thermal hysteresis 7 15 c t sdl status delay in overload conditions t j > t tsd 20 s i lim current limitation 5.5v < v cc < 36v 6915 15 a a v demag turn-off output clamp voltage i out = 2a; l = 6mh v cc - 41 v cc - 48 v cc - 55 v 1. to ensure long term reliability under heavy overload or short circuit conditions , protection and related diagnostic signals must be used together with a proper so ftware strategy. if the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles. table 11. open-load detection symbol parameter test conditions min. typ. max. unit i ol open-load on-state detection threshold v in = 5v 50 100 200 ma t dol(on) open-load on-state detection delay i out = 0a 200 s v ol open-load off-state voltage detection threshold v in = 0v 1.5 2.5 3.5 v t dol(off) open-load detection delay at turn-off 1000 s table 10. protections (1) (continued) symbol parameter test conditions min. typ. max. unit obsolete product(s) - obsolete product(s)
electrical specifications VND830PEP-E 10/25 doc id 10826 rev 6 figure 5. over temperature status timing figure 6. switching time waveforms table 12. truth table conditions inputn outputn statusn normal operation l h l h h h current limitation l h h l x x h (tj < ttsd) h (tj > ttsd) l over temperature l h l l h l undervoltage l h l l x x obsolete product(s) - obsolete product(s)
VND830PEP-E electrical specifications doc id 10826 rev 6 11/25 overvoltage l h l l h h output voltage > v oln l h h h l h output current < i oln l h l h h l table 13. electrical transient requirements on v cc pin (part 1/3) iso t/r 7637/1 test pulse test level i ii iii iv delays and impedance 1 - 25v - 50v - 75v - 100v 2ms, 10 2 + 25v + 50v + 75v + 100v 0.2ms, 10 3a - 25v - 50v - 100v - 150v 0.1s, 50 3b + 25v + 50v + 75v + 100v 0.1s, 50 4 - 4v - 5v - 6v - 7v 100ms, 0.01 5 + 26.5v + 46.5v + 66.5v + 86.5v 400ms, 2 table 14. electrical transient requirements on v cc pin (part 2/3) iso t/r 7637/1 test pulse test level i ii iii iv 1c c c c 2c c c c 3a c c c c 3b c c c c 4c c c c 5c e e e table 15. electrical transient requirements on v cc pin (part 3/3) class contents c all functions of the device are performed as designed after exposure to disturbance. e one or more functions of the device is not performed as designed after exposure and cannot be returned to proper operation without replacing the device. table 12. truth table (continued) conditions inputn outputn statusn obsolete product(s) - obsolete product(s)
electrical specifications VND830PEP-E 12/25 doc id 10826 rev 6 figure 7. waveforms obsolete product(s) - obsolete product(s)
VND830PEP-E electrical specifications doc id 10826 rev 6 13/25 2.4 electrical characteristics curves figure 8. off-state output current figure 9. high level input current figure 10. input clamp voltage figure 11. status leakage current figure 12. status low output voltage figure 13. status clamp voltage -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 il(off1) (a) vcc=36v -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 iih (a) vin=3.25v -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 6.2 6.4 6.6 6.8 7 7.2 7.4 7.6 7.8 8 vicl (v) iin=1ma -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 0 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.1 ilstat (a) vstat=5v -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 vstat (v) istat=1.6ma -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 6 6.2 6.4 6.6 6.8 7 7.2 7.4 7.6 7.8 8 vscl (v) istat=1ma obsolete product(s) - obsolete product(s)
electrical specifications VND830PEP-E 14/25 doc id 10826 rev 6 figure 14. turn-on voltage slope figure 15. turn-off voltage slope figure 16. on-state resistance vs tcase figure 17. on-state resistance vs v cc figure 18. i lim vs t case figure 19. input high level -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 100 200 300 400 500 600 700 800 900 1000 dvout/dt(on) (v/ms) vcc=13v rl=6.5ohm -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 100 150 200 250 300 350 400 450 500 dvout/dt(off) (v/ms) vcc=13v rl=6.5ohm -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 0 20 40 60 80 100 120 140 160 ron (mohm) iout=2a vcc=8v; 13v & 36v 5 10152025303540 vcc (v) 0 10 20 30 40 50 60 70 80 90 100 110 120 ron (mohm) tc=150c iout=2a tc=-40c tc= 25 c -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 0 2 4 6 8 10 12 14 16 18 20 ilim (a) vcc=13v -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 vih (v) obsolete product(s) - obsolete product(s)
VND830PEP-E electrical specifications doc id 10826 rev 6 15/25 figure 20. open-load on-state detection threshold figure 21. open-load off-state detection threshold figure 22. input hysteresis voltage figure 23. input low level figure 24. overvoltage shutdown figure 25. undervoltage shutdown -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 90 95 100 105 110 115 120 125 130 135 140 iol (ma) vcc=13v vin=5v -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 vol (v) vin=0v -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 vhyst (v) -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 vil (v) -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 32 34 36 38 40 42 44 46 48 50 vov (v) -50 -25 0 25 50 75 100 125 150 175 tc ( c ) 0 1 2 3 4 5 6 7 8 vusd (v) obsolete product(s) - obsolete product(s)
application information VND830PEP-E 16/25 doc id 10826 rev 6 3 application information figure 26. application schematic 3.1 gnd protection network against reverse battery this section provides two solutions for implementing a ground protection network against reverse battery. 3.1.1 solution 1: a resistor in the ground line (r gnd only) this can be used with any type of load. the following show how to dimension the r gnd resistor: 1. r gnd 600mv / (i s(on)max ) 2. r gnd ( - v cc ) / (- i gnd ) where - i gnd is the dc reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. power dissipation in r gnd (when v cc < 0 during reverse battery situations) is: p d = (- v cc ) 2 / r gnd this resistor can be shared amongst several different hsds. please note that the value of this resistor should be calculated with formula (1) where i s(on)max becomes the sum of the maximum on-state currents of the different devices. please note that, if the microprocessor ground is not shared by the device ground, then the r gnd will produce a shift (i s(on)max * r gnd ) in the input thresholds and the status output values. this shift will vary depending on how many devices are on in the case of several high side drivers sharing the same r gnd . obsolete product(s) - obsolete product(s)
VND830PEP-E application information doc id 10826 rev 6 17/25 if the calculated power dissipation leads to a large resistor, or several devices have to share the same resistor, then st suggests using solution 2 below. 3.1.2 solution 2: a diode (d gnd ) in the ground line a resistor (r gnd = 1k ) should be inserted in parallel to d gnd if the device will be driving an inductive load. this small signal diode can be safely shared amongst several different hsd. also in this case, the presence of the ground network will produce a shift ( 600mv) in the input threshold and the status output values if the microprocessor ground is not common with the device ground. this shift will not vary if more than one hsd shares the same diode/resistor network. series resistor in input and status lines are also required to prevent that, during battery voltage transient, the current exceeds the absolute maximum rating. safest configuration for unused input and status pin is to leave them unconnected. 3.2 load dump protection d ld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the v cc maximum dc rating. the same applies if the device is subject to transients on the v cc line that are greater than those shown in the iso t/r 7637/1 table. 3.3 mcu i/o protection if a ground protection network is used and negative transients are present on the v cc line, the control pins will be pulled negative. st suggests to insert a resistor (r prot ) in line to prevent the c i/o pins from latching up. the value of these resistors is a compromise between the leakage current of c and the current required by the hsd i/os (input levels compatibility) with the latch-up limit of c i/os: - v ccpeak / i latchup r prot (v oh c - v ih - v gnd ) / i ihmax example for the following conditions: v ccpeak = - 100v i latchup 20ma v oh c 4.5v 5k r prot 65k . recommended values are: r prot = 10k 3.4 open-load detection in off-state off-state open-load detection requires an external pull-up resistor (r pu ) connected between output pin and a positive supply voltage (v pu ) like the +5v line used to supply the microprocessor. the external resistor has to be selected according to the following requirements: () ()
application information VND830PEP-E 18/25 doc id 10826 rev 6 1. no false open-load indication when load is connected: in this case we have to avoid v out to be higher than v olmin ; this results in the following condition v out = (v pu / (r l +r pu )) r l < v olmin . 2. no misdetection when load is disconnected: in this case the v out has to be higher than v olmax ; this results in the following condition r pu < (v pu ? v olmax ) / i l(off2) . because i s(off) may significantly increase if v out is pulled high (up to several ma), the pull- up resistor r pu should be connected to a supply that is switched off when the module is in standby. the values of v olmin , v olmax and i l(off2) are available in the electrical characteristics section. figure 27. open-load detection in off-state obsolete product(s) - obsolete product(s)
VND830PEP-E package and pc board thermal data doc id 10826 rev 6 19/25 4 package and pc board thermal data 4.1 powersso-24 thermal data figure 28. powersso-24 pc board note: layout condition of rth and zth measurements (pcb fr4 area= 78mm x 78mm, pcb thickness=2mm, cu thickness=35m, copper areas: from minimum pad lay-out to 8cm 2 ). figure 29. r thj-amb vs pcb copper area in open box 40 45 50 55 60 0123456789 rthj_a mb(c/w) pcb cu heatsink area (cm^2) obsolete product(s) - obsolete product(s)
package and pc board thermal data VND830PEP-E 20/25 doc id 10826 rev 6 figure 30. powersso-24 thermal impedance junction ambient single pulse figure 31. thermal fitting model of a double channel hsd in powersso-24 equation 1 : pulse calculation formula where = t p /t 0.1 1 10 100 0.0001 0.001 0.01 0.1 1 10 100 1000 time (s) zth (c/w) footprint 8 cm 2 z th r th z thtp 1 ? () + ? = obsolete product(s) - obsolete product(s)
VND830PEP-E package and pc board thermal data doc id 10826 rev 6 21/25 table 16. thermal parameters area/island (cm 2 ) footprint 8 r1 = r7 (c/w) 0.1 r2 = r8 (c/w) 0.9 r3 (c/w) 1 r4 (c/w) 4 r5 (c/w) 13.5 r6 (c/w) 37 22 c1 = c7 (w.s/c) 0.0006 c2 = c8 (w.s/c) 0.0025 c3 (w.s/c) 0.025 c4 (w.s/c) 0.08 c5 (w.s/c) 0.7 c6 (w.s/c) 3 5 obsolete product(s) - obsolete product(s)
package information VND830PEP-E 22/25 doc id 10826 rev 6 5 package information 5.1 ecopack ? packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. 5.2 powersso-24 mechanical data figure 32. powersso-24 package dimensions obsolete product(s) - obsolete product(s)
VND830PEP-E package information doc id 10826 rev 6 23/25 table 17. powersso-24 mechanical data symbol millimeters min. typ. max. a 2.45 a2 2.15 2.35 a1 0 0.10 b 0.33 0.51 c 0.23 0.32 d 10.10 10.50 e 7.40 7.60 e0.8 e3 8.8 f2.3 g 0.1 g1 0.06 h10.1 10.5 h 0.4 k0 8 l 0.55 0.85 n 10o x4.1 4.7 y6.5 7.1 obsolete product(s) - obsolete product(s)
revision history VND830PEP-E 24/25 doc id 10826 rev 6 6 revision history table 18. document revision history date revision changes 04-oct-2004 1 initial release. 15-nov-2004 2 mechanical data updating. powersso-24 thermal characteristics insertion 27-nov-2004 3 pc board copper area correction. 12-dec-2005 4 electrical characteristics insertion. absolute maximum ratings modification. 01-jul-2009 5 updated figure 17: powersso-24 mechanical data : ? deleted a (min) value ? changed a (max) value from 2.47 to 2.45 ? changed a2 (max) value from 2.40 to 2.35 ? changed a1 (max) value from 0.075 to 0.1 ? inserted f and k rows 20-sep-2013 6 updated disclaimer. obsolete product(s) - obsolete product(s)
VND830PEP-E doc id 10826 rev 6 25/25 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statem ents and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - swed en - switzerland - united kingdom - united states of america www.st.com obsolete product(s) - obsolete product(s)

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